All Modules: Photolithography / Pre-assembly / Reconstitution / Thin Film / Wet Etch / Tape & Reel / Back Grind / Backend
Key Job Accountabilities (Actual daily deliverables) :
- Perform set-up and conversion to support production.
- Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.
- Determine methods and procedures independently and provide guidance to less experienced team members when required.
- Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists.
- Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.
Required Qualifications:
- Diploma in Mechanical Engineering, Physics, Chemical, Material Sciences or equivalent.
- 2 years of relevant experience in wafer bumping or wafer fabrication are preferred otherwise candidates without experience are welcomed to apply as training will be provided.
- Ability to work on 12 hours rotating shift.