Key Job Accountabilities:
- To establish new processes & tooling capability based on unit process/equipment/material roadmap, related to advanced packaging, 2.5/3D, heterogenous integration, wafer-level packaging process technologies.
- Establish assembly material selection guide systematic and sustaining in Unit Process Technology roadmapping.
- Perform material and equipment tool benchmarking, understand and converging customers’ product requirements with equipment supplier capabilities.
- Lead new equipment phase-in and commissioning in factory for new R&D and NPI projects.
- Perform process, equipment and tooling capabilities reviews for New Technologies or New Products requirements. Interaction with Business Units and Process Engineering team for new package and process development, aligning with R&D strategy for material selection and equipment/tooling benchmarking systematic.
Required Experience and Qualifications:
- Degree in Engineering (Mechanical/Chemical/Electrical Engineering or science in Chemistry/Physic).
- Minimum of 10 years of experience in semiconductor industry, related to process and equipment engineering.
- Strong knowledge of wafer-level packaging technology, AOI, and chip attachment methods.
- Knowledge in DOE, process control (Lean six sigma or DMAIC) and Statistical Tools, such as JMP.
- Strong cross-functional teamwork, collaboration, interpersonal, written and business skills.
- Good communication skills in dealing with Business Units, suppliers and customers.
- Lead project across organization and culture in a fast-paced environment
- Good analytical and problem-solving skills, and able to work independently with minimal supervision.
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