R&D Engineer (Food Packaging Manufacturing)

JDA WMS PTE. LTD.
$4,500 - $6,500 a month
Singapore
2 weeks ago

Key Responsibilities:

  • Lead or support research and development projects for new and improved food packaging materials, formats, and technologies.
  • Evaluate packaging materials (plastics, films, laminates, paper, etc.) for mechanical strength, barrier properties, food safety, and regulatory compliance.
  • Conduct lab trials, prototyping, and pilot-scale production runs for packaging development.
  • Work closely with production, quality, and procurement teams to ensure new designs are scalable and cost-effective.
  • Collaborate with marketing and product development to create packaging that meets consumer needs and brand requirements.
  • Monitor industry trends, technologies, and sustainability initiatives to recommend innovations.
  • Perform root cause analysis and provide technical solutions for packaging-related quality issues.
  • Ensure packaging complies with relevant food safety and regulatory standards (e.g., FDA, EU, ISO, HACCP).
  • Maintain proper documentation including test reports, specifications, drawings, and technical data sheets.

Requirements:

  • Bachelor’s Degree in Materials Science, Chemical Engineering, Mechanical Engineering, Packaging Engineering, or a related field.
  • 2–5 years of experience in packaging R&D, preferably in food, FMCG, or manufacturing environment.
  • Knowledge of packaging materials, manufacturing processes (extrusion, thermoforming, injection molding), and barrier technologies.
  • Familiarity with food safety and packaging compliance standards.
  • Hands-on experience with lab testing, packaging prototyping, and process scale-up.
  • Strong analytical, problem-solving, and project management skills.
  • Effective communication and ability to work cross-functionally in a fast-paced environment.

If interested, please submit your application with your expected salary and resume.


We regret that only short-listed candidates will be contacted shortly. By submitting your application or resume, you agree to the collection, use, retention, and sharing of your personal information with potential employers for their assessment.


JDA WMS Pte Ltd | EA Personnel: Pham Thi Tuyet Mai

EA License No: 23S1595 | EA Registration No: R25127838

Apply
Other Job Recommendations:

Senior Research Engineer (Heterogeneous Integration – Wafer Level Packaging/ Fan-out Wafer Level Packaging), IME

Agency for Science, Technology and Research (A*STAR)
Singapore
$59,408 - $75,224 a year
Research Engineer will be part of heterogeneous integration group focused on development of the advanced packaging technology...
3 weeks ago

New Product Manufacturing Engineer (MDP Packaging)

Applied Materials
$61,875 - $78,348 a year
Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced...
1 week ago

Engineer, Shift Lead, Advanced Packaging Technology Development

Micron Technology
  • Complete the required safety training and conducts all work...
  • Follows-up on safety and quality related issues immediately...
2 days ago

Principal / Senior Engineer, New Product Introduction - IC Packaging, Technical Operations Management

Continental
Singapore
  • Lead NPI process from Concept to Mass Production at OSAT...
  • Define and implement Package Development, Assembly and...
4 weeks ago

Engineer, Advanced Packaging Equipment Engineering

Micron Technology
Singapore
$61,505 - $77,879 a year
  • Develop and optimize advanced packaging equipment for...
  • Focus on improving equipment capability, enabling process...
4 weeks ago