Job Responsibilities:
- 2.5D/3DIC platform development.
- New unit module development and devices development.
- New process verification and qualification.
- New platform DSM setup
- Customer engagement and new product verification
Capability
- Solid semiconductor process integration and device characterization skills
- Semiconductor device physics and analysis skill.
- Experienced in 2.5D and 3DIC process development are plus.
- Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
- Good communication, self-motived and avid learner
Qualification
- At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields.
- At least 7 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer.
- Working experience: 2.5D and 3DIC integration and device background are plus.
- Proficient English oral and writing skill.
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