Process development for multi-chip and high density FOWLP for various applications such as Chiplets packaging for high power computing, Co-package Optics, Power devices etc.
Plan and perform DOEs for various process development and materials evaluation for FOWLP
Establish integration flows for advanced packages
Coordinate and support engineering build of new packages and development
Work with industry partners and multidisciplinary team members to execute assigned tasks and resolve issues for projects
Publish new findings and technological advancement in prestigious journals and overseas/local conferences.
Job Requirements
University degree or Masters in Electronics / Microelectronics / Material Engineering / Material Science / Chemistry / Physics.
Prior experience in developing wafer level packaging and fan-out wafer level packaging
Knowledge of advanced packaging technologies such as photolithography, ECP, PVD, plasma and wet etching is preferred
Good analytical, communication and presentation skills
The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.
Type of Employment : Full-Time
Minimum Experience : 3 Years
Work Location : Science Park
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